Puhui reflow solder paste, leaded solder paste, low-temperature solder paste 6337, medium-low temperature solder paste, tin paste, tin paste

Puhui reflow solder paste, leaded solder paste, low-temperature solder paste 6337, medium-low temperature solder paste, tin paste, tin paste - Image 2

Puhui reflow solder paste, leaded solder paste, low-temperature solder paste 6337, medium-low temperature solder paste, tin paste, tin paste

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Category: Electronics manufacturing

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Description

Reflow solder paste including leaded, low-temperature, 6337 and medium-low temperature formulations. The Puhui solder paste ensures smooth printing, good wettability and reliable solder joints for SMT assembly. Suitable for a wide range of electronic production processes.

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